* Four workstations each with a wafer process capacity of up to 100mm/4″

* Bluetooth enabled features such as automatic plate flatness control and real time data collection and feedback from digital indicator on jigs for end point thickness control and increased accuracy

* Metered abrasive feed delivery via peristaltic pumps allowing users to set the flow rate between 1-100ml

* Driven jig roller arm technology greatly increases accuracy and repeatability

* Plate speeds of between 5 and 100rpm, facilitating faster lapping and polishing rates